Capabilities
|
Attributes |
Standard |
Advanced |
Notes |
|
Panel Sizes (Single Sided, Double Sided) |
12″ X 18″, 18″ X 24″ |
18″ X 24″ |
|
|
Panel Sizes (Multilayer) |
12″ X 18″, 18″ X 24″ |
18″ X 24″ |
|
|
Panel Sizes (Flexible Circuits) |
12″ X 18″, 18″ X 24″ |
18″ X 30″ |
|
|
Panel Sizes (Rigid-Flex) |
12″ X 18″, 18″ X 24″ |
18″ X 24″ |
|
|
Maximum Layers |
12 |
30 |
|
|
Flex layer Counts |
2 |
8 |
|
|
Rigid Flex Layer Counts |
4 |
8 |
|
|
Maximum Board Thickness |
.125″ |
.200″ |
|
|
Minimum Core Dielectric Thickness |
.003″ |
.002″ |
|
|
Minimum Prepreg Dielectric Thickness |
.003″ |
.002″ |
|
|
Minimum Copper Weight – Inner Layer (oz) |
1/2 oz |
N/A |
|
|
Minimum Starting Copper Weight – Outer Layer (oz) |
3/8 oz |
1/4 oz |
|
|
Maximum Copper Weight – Inner Layer (oz) |
6 oz |
8 oz |
|
|
Maximum Starting Copper Weight – Outer Layer (oz) |
2 oz |
14 oz |
|
|
Materials |
Standard |
Advanced |
IPC-4101 |
|
Isola 370HR |
Yes |
Yes |
/98/99/101/126 |
|
Isola 185HR |
Yes |
Yes |
/98/99/101/126 |
|
Isola FR406-FR406N |
Yes |
Yes |
/21/24/26 |
|
Isola IS402 |
Yes |
Yes |
/97/98/99/101 |
|
Nan Ya FR-4-86 |
Yes |
Yes |
/21 |
|
Nan Ya NP-180R |
Yes |
Yes |
|
|
Nan Ya NP-180TL |
Yes |
Yes |
|
|
Ventec VT-42 |
Yes |
Yes |
/21 |
|
Ventec VT-47 |
Yes |
Yes |
/97/98/99/101 |
|
Ventec VT-481 |
Yes |
Yes |
/97/98/99/101 |
|
Ventec VT-5A2 |
Yes |
Yes |
|
|
Ventec VT-4B Seies |
Yes |
Yes |
|
|
Bergquist T-Clad |
Yes |
Yes |
|
|
Kingboard KB-6160 |
Yes |
Yes |
/21 |
|
Shengyi SN-L3 |
Yes |
Yes |
|
|
Shengyi SN-L4 |
Yes |
Yes |
|
|
Shengyi S1141 |
Yes |
Yes |
|
|
Shengyi S1170 |
Yes |
Yes |
|
|
Panasonic Megtron 6 |
Yes |
Yes |
|
|
Panasonic R-F775 |
Yes |
Yes |
|
|
Dupont Pyralux® FR Clads |
Yes |
Yes |
|
|
Rogers 3000 Series |
Yes |
Yes |
|
|
Rogers 4000 Series |
Yes |
Yes |
|
|
Rogers CITE |
Yes |
Yes |
|
|
Imaged Features |
Standard |
Advanced |
Notes |
|
Inner Layer Line Width |
0.005″ |
0.003″ |
|
|
Inner Layer Spacing |
0.005″ |
0.003″ |
Hoz. Copper |
|
External Layer Line Width |
0.005″ |
0.003″ |
|
|
External Layer Spacing |
0.005″ |
0.003″ |
Hoz. Copper |
|
Minimum Pad |
0.015″ |
0.008″ |
|
|
SMT Pitch |
0.010″ |
0.008″ |
|
|
Hole Technology |
Standard |
Advanced |
Notes |
|
Smallest Mechanical Drilled Via |
0.0079″ |
0.006″ |
|
|
Aspect Ratio |
10:1 |
12:1 |
|
|
pxH Tolerance {+/-} |
0.003″ |
0.002″ |
|
|
NpxH Tolerance {+/-} |
0.001″ |
0.001″ |
|
|
Minimum Cu Clearance to Hole |
0.008″ |
0.006″ |
|
|
Solder Mask/Legend |
Standard |
Advanced |
Notes |
|
LPI Solder Mask |
Green, Blue, Red, Clear |
Black, White, LED White |
|
|
Minimum Clearance |
0.003″ |
0.002″ |
|
|
Minimum Web |
0.005″ |
0.004″ |
|
|
Legend Color |
White, Black |
Yellow |
|
|
Surface Finish |
Standard |
Advanced |
Notes |
|
Electroless Nickel Immersion Gold (ENIG) |
Yes |
Yes |
|
|
Electrolytic Nicked Gold (ENEG) |
Yes |
Yes |
Vertical Gold Tab |
|
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
Yes |
Yes |
Outside Service |
|
Immersion Silver |
Yes |
Yes |
|
|
Immersion Tin |
Yes |
Yes |
Outside Service |
|
Hot Air Solder Level (HASL) |
Yes |
Yes |
|
|
Lead Free Hot Air Solder Level (LF HASL) |
Yes |
Yes |
|
|
Organic Solderability Preservatives (OSP) |
Yes |
Yes |
Outside Service |
|
Fabrication |
Standard |
Advanced |
Notes |
|
IL Copper to Board Edge – Routed |
.010″ |
.007″ |
|
|
OL Copper to Board Edge – Routed |
.008″ |
.005″ |
|
|
“V” Groove Scoring – Profile Tolerance |
+ / – .010″ |
+ / – .010″ |
Min Panel Thickness .031 |
|
Test |
Standard |
Advanced |
Notes |
|
Flying Probe Test |
Yes |
Yes |
|
|
TDR |
Yes |
Yes |
|
|
Ionics |
Yes |
Yes |
|
|
CMI XRF |
Yes |
Yes |
|
|
Additional Capabilities |
Standard |
Advanced |
Notes |
|
Buried/Blind Via |
No |
Yes |
|
|
Plugged Vias (mask) |
No |
Yes |
|
|
Castellated Holes |
Yes |
Yes |
|
|
Edge Plating |
Yes |
Yes |
|
|
Via Fill – Conductive/Non-Conductive |
Yes |
Yes |
|
|
Countersink/Counterbore/Beveling |
Yes |
Yes |
|
|
Milling/Controlled Depxh |
Yes |
Yes |
|
|
Controlled Impedance |
Yes + / – 10% |
Yes + / – 5% |
|
